系所介紹

類型	年份	著作/計畫名稱	著作人	參與人	擔任之工作	計畫時間	補助/委託或合作機構	獎項名稱	得獎人	頒獎單位	日期
期刊論文	2014	Antimicrobial properties of Zr–Cu–Al–Ag thin film metallic glass, Thin Solid FilmsC4	H. W. Chen*, K. C. Hsu*, Y. C. Chan*, J. G. Duh!, J. W. Lee, Jason S. C. Jang, G. J. Chen
期刊論文	2014	Modification of structure and property in Zr-based thin film metallic glass via processing temperature control, Thin Solid Films	J. H. Chu*, H. W. Chen*, Y. C. Chan*, J. G. Duh!, J. W. Lee, Jason S. C. Jang
期刊論文	2014	Texture, microstructure and tribological behavior in TiAlN/SiNx multilayers, Int. J. Appl. Ceram. Technol.	Y. C. Chan* , H. W. Chen*, J. G. Duh!, J. W. Lee
	2014	摻入雜質低維半導體奈米結構合成、鑑定與應用(3/3)		陳力俊	主持人	2014年08月 ~ 2015年07月
期刊論文	2014	Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testing, Journal of Alloys and Compounds, 586, (2014) 633-638	C. Y. Yu*, W. Y. Chen*, and J. G. Duh!
期刊論文	2014	Enhancement of the impact toughness in Sn-Ag-Cu/Cu solder joints via modifying the microstructure of solder alloy, Materials Letters 119 (2014) 20–23	C. Y. Yu*, Joseph Lee*, W. L. Chen*, and J. G. Duh!
期刊論文	2014	Improving the shear strength of Sn-Ag-Cu-Ni/Cu-Zn solder joints via modifying the microstructure and phase stability of Cu-Sn intermetallic compounds, Intermetallics, 54 (2014) 181–186	W. Y. Chen*, C. Y. Yang*, and J. G. Duh!
期刊論文	2014	Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies, Journal of Alloys and Compounds, 600, (2014) 199-203.	C.Y. Ho*, M.T. Tsai*, J. G. Duh!, and J.W. Lee
期刊論文	2014	Optimal Ni(P) Thickness Design in Ultrathin-ENEPIG Metallization for Soldering: Concerning Electrical Impedance and Mechanical Bonding Strength, Materials Science and Engineering A 611 (2014) 162-169	C. Y. Ho* and J.G. Duh!
期刊論文	2014	Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint, Journal of Alloys and Compounds	C. F. Tseng*, C. Y. Ho*, J. Lee*, and J. G. Duh!
期刊論文	2014	Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of the Cu-Sn intermetallic compounds in soldering reaction, Materials Chemistry and Physics 148 (2014) 21-27	C. Y. Ho* and J. G. Duh!
期刊論文	2014	Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints, Materials Science and Engineering A 613(8) (2014) 193–200	Wen-Lin Chen*, Chi-Yang Yu*, Cheng-Ying Ho* and Jenq-Gong Duh!
期刊論文	2014	Growth orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn microbumps and Zn-doped solder joints, Materials letters 134 (2014) 184-186	Wei-Yu Chen*, Wei Tu* , Hsiang-Ching Chang* , Tzu-Ting Choua* and Jenq-Gong Duh!
	2014	複合金屬氧化物奈米結構的開發及其在能源, 微電子的可能應用(3/3)		甘炯耀	主持人	2014年08月 ~ 2015年07月
期刊論文	2014	Spin and phonon anomalies in epitaxial self-assembled CoFe2O4-BaTiO3 multiferroic nanostructures, APPLIED PHYSICS LETTERS	Tsai, CY (Tsai, C. Y.)* ; Cheng, HM (Cheng, H. M.)* ; Chen, HR (Chen, H. R.)* ; Huang, KF (Huang, K.
	2014	高效率薄型太陽電池技術研究		甘炯耀	主持人	2014年03月 ~ 2014年11月
期刊論文	2014	Conduction control at ferroic domain walls via external stimuli, NANOSCALE	Yang, JC (Yang, J. C.)*; Yeh, CH (Yeh, C. H.)*; Chen, YT (Chen, Y. T.)* ; Liao, SC (Liao, S. C.)* ;
	2014	高性能耐火高熵合金的開發研究(2/3)		葉均蔚	主持人	2014年08月 ~ 2015年07月
期刊論文	2014	Anisotropic strain, magnetic properties, and lattice dynamics in self-assembled multiferroic CoFe2O4-PbTiO3 nanostructures, JOURNAL OF APPLIED PHYSICS	Tsai, CY (Tsai, C. Y.)* ; Chen, HR (Chen, H. R.)*; Chang, FC (Chang, F. C.)* ; Kuo, HH (Kuo, H. H.)*
	2014	以合金設計法與先進製粉技術開發及製作雷射積層製造之高品質超硬合金製品		葉均蔚	共同主持人	2014年11月 ~ 2015年10月