學術著作
| 類型 | 年份 | 著作/計畫名稱 | 著作人 | 參與人 | 擔任之工作 | 計畫時間 | 補助/委託或合作機構 | 獎項名稱 | 得獎人 | 頒獎單位 | 日期 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 期刊論文 | 2014 | Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: Controllable nanotwin density and growth orientation with enhanced electrical endurance performance, Nanoscale, 6, 7332 | T. C. Chan*, Y. M. Lin*, H. W. Tsai*, C. C. Lin*, Z. M. Wang, C. N. Liao!, Y. L. Chueh! | ||||||||
| 期刊論文 | 2014 | Exploration of Surface Hydrophilic Properties on AISI 304 stainless steel and silicon wafer against aging after atmospheric pressure plasma treatment, Japanese Journal of Applied Physics | Shang-I Chung* and Jenq-Gong! | ||||||||
| 期刊論文 | 2014 | Antimicrobial characteristics in Cu-containing Zr-based thin film metallic glass, Surface and Coatings Technology | Jia-Hong Chu*, Joseph Lee*, Chun-Chi Chang*, Yu-Chen Chan*, Ming-Li Liou*, Jyh-Wei Lee, Jason Shian- | ||||||||
| 期刊論文 | 2014 | Antimicrobial properties of Zr–Cu–Al–Ag thin film metallic glass, Thin Solid FilmsC4 | H. W. Chen*, K. C. Hsu*, Y. C. Chan*, J. G. Duh!, J. W. Lee, Jason S. C. Jang, G. J. Chen | ||||||||
| 期刊論文 | 2014 | Modification of structure and property in Zr-based thin film metallic glass via processing temperature control, Thin Solid Films | J. H. Chu*, H. W. Chen*, Y. C. Chan*, J. G. Duh!, J. W. Lee, Jason S. C. Jang | ||||||||
| 期刊論文 | 2014 | Texture, microstructure and tribological behavior in TiAlN/SiNx multilayers, Int. J. Appl. Ceram. Technol. | Y. C. Chan* , H. W. Chen*, J. G. Duh!, J. W. Lee | ||||||||
| 期刊論文 | 2014 | Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testing, Journal of Alloys and Compounds, 586, (2014) 633-638 | C. Y. Yu*, W. Y. Chen*, and J. G. Duh! | ||||||||
| 期刊論文 | 2014 | Enhancement of the impact toughness in Sn-Ag-Cu/Cu solder joints via modifying the microstructure of solder alloy, Materials Letters 119 (2014) 20–23 | C. Y. Yu*, Joseph Lee*, W. L. Chen*, and J. G. Duh! | ||||||||
| 期刊論文 | 2014 | Improving the shear strength of Sn-Ag-Cu-Ni/Cu-Zn solder joints via modifying the microstructure and phase stability of Cu-Sn intermetallic compounds, Intermetallics, 54 (2014) 181–186 | W. Y. Chen*, C. Y. Yang*, and J. G. Duh! | ||||||||
| 期刊論文 | 2014 | Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies, Journal of Alloys and Compounds, 600, (2014) 199-203. | C.Y. Ho*, M.T. Tsai*, J. G. Duh!, and J.W. Lee | ||||||||
| 期刊論文 | 2014 | Optimal Ni(P) Thickness Design in Ultrathin-ENEPIG Metallization for Soldering: Concerning Electrical Impedance and Mechanical Bonding Strength, Materials Science and Engineering A 611 (2014) 162-169 | C. Y. Ho* and J.G. Duh! | ||||||||
| 期刊論文 | 2014 | Crystallographic characterization and growth behavior of (Cu,Ni,Pd)6Sn5 intermetallic compound in Ni(P)/Pd/Au/SnAgCu/Cu assembled solder joint, Journal of Alloys and Compounds | C. F. Tseng*, C. Y. Ho*, J. Lee*, and J. G. Duh! | ||||||||
| 期刊論文 | 2014 | Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of the Cu-Sn intermetallic compounds in soldering reaction, Materials Chemistry and Physics 148 (2014) 21-27 | C. Y. Ho* and J. G. Duh! | ||||||||
| 期刊論文 | 2014 | Effects of thermal annealing in the post-reflow process on microstructure, tin crystallography, and impact reliability of Sn–Ag–Cu solder joints, Materials Science and Engineering A 613(8) (2014) 193–200 | Wen-Lin Chen*, Chi-Yang Yu*, Cheng-Ying Ho* and Jenq-Gong Duh! | ||||||||
| 期刊論文 | 2014 | Growth orientation of Cu-Sn IMC in Cu/Sn-3.5Ag/Cu-xZn microbumps and Zn-doped solder joints, Materials letters 134 (2014) 184-186 | Wei-Yu Chen*, Wei Tu* , Hsiang-Ching Chang* , Tzu-Ting Choua* and Jenq-Gong Duh! | ||||||||
| 期刊論文 | 2014 | Spin and phonon anomalies in epitaxial self-assembled CoFe2O4-BaTiO3 multiferroic nanostructures, APPLIED PHYSICS LETTERS | Tsai, CY (Tsai, C. Y.)* ; Cheng, HM (Cheng, H. M.)* ; Chen, HR (Chen, H. R.)* ; Huang, KF (Huang, K. | ||||||||
| 期刊論文 | 2014 | Conduction control at ferroic domain walls via external stimuli, NANOSCALE | Yang, JC (Yang, J. C.)*; Yeh, CH (Yeh, C. H.)*; Chen, YT (Chen, Y. T.)* ; Liao, SC (Liao, S. C.)* ; | ||||||||
| 期刊論文 | 2014 | Anisotropic strain, magnetic properties, and lattice dynamics in self-assembled multiferroic CoFe2O4-PbTiO3 nanostructures, JOURNAL OF APPLIED PHYSICS | Tsai, CY (Tsai, C. Y.)* ; Chen, HR (Chen, H. R.)*; Chang, FC (Chang, F. C.)* ; Kuo, HH (Kuo, H. H.)* | ||||||||
| 期刊論文 | 2014 | Design of magnetoelectric coupling in a self-assembled epitaxial nanocomposite via chemical interaction, JOURNAL OF MATERIALS CHEMISTRY C | Liang, WI (Liang, Wen I.)* ; Liu, YM (Liu, Yuangming)* ; Liao, SC (Liao, Sheng Chieh)*; Wang, WC (Wa | ||||||||
| 期刊論文 | 2014 | Using binary resistors to achieve multilevel resistive switching in multilayer NiO/Pt nanowire arrays, NPG ASIA MATERIALS | Huang, YC (Huang, Yen-Chun)* ; Chen, PY (Chen, Po-Yuan)* ; Huang, KF (Huang, Kuo-Feng)* ; Chuang, TC |