系所介紹

類型	年份	著作/計畫名稱	著作人	參與人	擔任之工作	計畫時間	補助/委託或合作機構	獎項名稱	得獎人	頒獎單位	日期
期刊論文	2013	Enhanced Seebeck coefficient of bismuth telluride compounds with graded doping profiles, Appl. Phys. Lett.	H.-H. Huang*, M.-P. Lu*, C.-H. Chiu*, L.-C. Su*, C. N. Liao!, J.-Y. Huang, H.-L. Hsieh
	2013	Mechanical and thermal processing effects on crystal defects and thermoelectric transport properties of Bi2(Se,Te)3 compounds, J. Alloys Compd.	M.-P. Lu* and C. N. Liao!
期刊論文	2013	Morphology, Texture and Twinning Structure of Cu Films Prepared by Low-temperature Electroplating, J. Electrochem. Soc.	C. N. Liao!, C.-Y. Lin*, C.-L. Huang* and Y.-S. Lu*
期刊論文	2013	Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition, J. Electrochem. Soc.	C. N. Liao!, Y. C. Lu* and D. Xu,
期刊論文	2013	The influence of boron contents on the microstructure and mechanical properties of Cr–B–N thin films, Vacuum 87	J. W. Lee!, C. C. Hong*, H. W. Chen*, L. W. Ho*, J. G. Duh, and Y. C. Chan*
期刊論文	2013	Microstructure control in TiAlN/SiNx multilayers with appropriate thickness ratios for improvement of hardness and anti-corrosion characteristics, Vacuum 87	Y. C. Chan*, H. W. Chen*, P. S. Chao*, J. G. Duh!, and J. W. Lee
期刊論文	2013	The influence of Pd on growth behavior of a quaternary (Cu,Ni,Pd)6Sn5 compound in Sn–3.0Ag–0.5Cu/Au/Pd/Ni–P solder joint during a liquid state reaction, Journal of Materials Science 48	C. F. Tseng*, and J. G.Duh!
期刊論文	2013	Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder, Materials Letters 92	C. Y. Ho*, and J. G. Duh!
期刊論文	2013	Nanostructured LiNi0.5Mn1.5O4 cathode material synthesized by polymer-assisted co-precipitation method with improved rate capability, Materials Letters 93	Y. C. Jin*, and J. G. Duh!
期刊論文	2013	Study of the Zn occupancy leading to the stability improvement for Cu6Sn5 using a first-principles approach, Materials Letters 93	W. Q. Shao!*, C. Y. Yu*, W. C. Lu, J. G. Duh, and S. O. Chen
期刊論文	2013	Microstructural variation and high-speed impact responses of Sn–3.0Ag–0.5Cu/ENEPIG solder joints with ultra-thin Ni–P deposit, Journal of Materials Science 48	C. Y. Ho*, J. G. Duh!, C. W. Lin, C. J. Lin, Y. H. Wu*, H. C. Hong, and T. H. Wang*
期刊論文	2013	The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance, Journal of Electronics Materials 42	T. K. Lee!, B. Zhou*, T. R. Bieker, C. F. Tseng*, and J. G. Duh
	2013	Electrochemical characterization of Zr-based thin film metallic glass in hydrochloric aqueous solution, Thin Solid Film	C. Y. Chuang*, Y. C. Liao*, J. W. Lee!, C. L. Li*, J. P. Chu, and J. G. Duh
期刊論文	2013	Large E-field tunability of microwave ferromagnetic properties in Fe50Co50-Hf/lead zinc niobate–lead titanate multiferroic laminates, Journal of Applied Physics	S. D. Li!, M. Liu*, W. Shao*, J. Xu, S. Chen, Z. Zhou*, T. Nan*, N. X. Sun, and J. G. Duh
期刊論文	2013	Stress competition and vortex magnetic anisotropy in FeCoAlO high-frequency soft magnetic films with gradient Al-O contents", Journal of Applied Physics	S. D. Li!, H. Du*, Q. Xue*, S. Xie*, M. Liu*, W. Shao*, J. Xu, T. Nan*, N. X. Sun, and J. G. Duh
期刊論文	2013	Roles of Cu in Pb-free Solders Jointed with Electroless Ni(P) Plating, Materials Science and Engineering A	C. F. Tseng*, C. J. Lee*, and J. G. Duh!
期刊論文	2013	Retardation of (Cu, Ni)6Sn5 spalling in Sn-Ag-Cu/Ni solder joints via controlling the grain structure of Ni metallization layer, Materials Letters	Y. H. Wu*, C. Y. Yu*, C. Y. Ho* and J. G. Duh!
	2013	Correlation between Microstructure Evolution and Mechanical Strength in the Sn-3.0Ag-0.5Cu/ENEPIG Solder Joint, Materials Science and Engineering A	C. F. Tseng* and J. G. Duh!
	2013	Microwave Frequency Performance and High Magnetic Anisotropy of Nanocrystalline Fe70Co30-B Films Prepared by Composition Gradient Sputtering, journal of nanoscience and nanotechnology	S. D. Li!, M. Liu*, J. Lou*, X. Xing*, J. P. Wu*, Y. Hu*, X. L. Cai*, F. Xu*, N. X. Sun, and J. G. D
期刊論文	2013	Tunable Microwave Frequency Performance of Nanocomposite Co2MnSi/PZN-PT Magnetoelectric Coupling Structure", journal of nanoscience and nanotechnology	S. D. Li!, M. Liu*, J. Lou*, X. Xing*, J. Qiu*, J. H. Lin*, Z. Y. Cai*, F. Hu*, N. X. Sun, and J. G.