Publication List

●期刊論文 ●研討會論文 ●其他

(A)  期刊論文

1.      C. N. Liao and K. N. Tu, (2002), “Direct measurement of contact temperature using Seebeck potential”, J. Appl. Phys., 92, 635 (SCI) NSC- 90-2218-E-007-067

2.      C. N. Liao and K. C. Chen, (2003), “Current crowding effect on thermal characteristics of Ni/doped-Si contacts”, IEEE Electron Device Letters, 24, 637 (SCI) NSC-91-2216-E007-050

3.      C. N. Liao and C. T. Wei, (2004),”Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment”, J. Electron. Mat., 33, 1137 (SCI) NSC-92-2216-E-007-023

4.      C. N. Liao and K. M. Liou, (2005), “Electrical properties of Cu/Ta interfaces under electrical current stressing”, J. Vac. Sci. Tech. A, 23, 359 (SCI)

5.      C. N. Liao and S. W. Kuo, (2005), “Thermoelectric characterization of sputter-deposited Bi/Te bilayer thin films”, J. Vac. Sci. Tech. A, 23, 559 (SCI) NSC-93-2216-E-007-026

6.      C. N. Liao and K. C. Chen, (2005) “Effect of interfacial resistance and contact size on current crowding at Ni/poly-Si junctions”, Semi. Sci. Tech., 20, 659 (SCI)

7.      C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen, (2005) “In situ transmission electron microscope observations of electromigration in copper lines at room temperature”, Appl. Phys. Lett., 87, 141903. (SCI)

8.      C. N. Liao, C. P. Chung and W. T. Chen, (2005) “Electromigration induced Pb Segregation in Eutectic Sn-Pb Molten Solder”, J. Mat. Res., 20, 3425 (SCI) NSC-93-2216-E-007-045

9.      C. N. Liao and C. T. Wei, (2006) “An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples”, Thin Solid Films, 515, 2781 (SCI) NSC-92-2216-E-007-023

10.  C. N. Liao, H. N. Wu, P. C. Chen and J. W. Yeh, (2006) “Effect of antimony doping on thermoelectric properties of Zr0.5Ti0.5NiSn multi-element alloys”, ANNALES DE CHIMIE - science des matériaux, 31(6), 711 (SCI) NSC-93-2216-E-007-026.

11.  C. N. Liao, T. H. She, P. J. Liao and H. S. Chu, (2007) “Oscillatory transport properties of thermally annealed Bi/Te multilayer thin films”, Journal of The Electrochemical Society 154 (4), H304 (SCI) NSC-94-2216-E-007-019.

12.  C. M. Tai and C. N. Liao, (2007) “Multi-level suspended thin film inductors on silicon wafers”, IEEE Trans. Electron. Dev., 54 (6), 1510 (SCI)

13.  C. N. Liao and T. H. She, (2007) “Preparation of bismuth telluride thin films through interfacial reaction”, Thin Solid Films, 515, 8059 (SCI) NSC-94-2216-E-007-019.

14.  K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen, (2007) “Direct observation of electromigration-induced surface atomic steps in Cu lines by in-situ transmission electron microscopy”, Appl. Phys. Lett., 90, 203101. (SCI)

15.  C. M. Chen, C. C. Huang, C. N. Liao, and K. M. Liou, (2007) “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, J. Electron. Mat. 36, 760 (SCI)

16.  C. N. Liao, C. H. Lee and W. J. Chen, (2007) “Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride based thermoelements and copper”, Electrochem. Solid-State Lett., 10(9), P23 (SCI) NSC 95-2221-E-007-051

17.  C. M. Tai and C. N. Liao, (2007) ”A Physical Model of Solenoid Inductors on Silicon Substrates”,IEEE Trans. Microwave Theory Tech., 55(12), 2579 (SCI)

18.  C. N. Liao, K. M. Liou and H. S. Chu, (2008) “Enhancement of thermoelectric properties of sputtered Bi-Sb-Te thin films by electric current stressing”, Appl. Phys. Lett., 93, 042103. (SCI) NSC-96-2628-E-007-018-MY3

19.  K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu, (2008) “Observation of Atomic Diffusion at Twin-modified Grain Boundaries in Copper”, Science, 321, 1066 (SCI) NSC-96-2628-E-007-018-MY3

20.  S. D. Li, J. G. Duh and C. N. Liao, (2008) “High-frequency ferromagnetic inductors covered by as-deposited FeCoAlO films with stress-induced uniaxial anisotropy”, Thin Solid Films, 516, 7748 (SCI)

21.  C. N. Liao and C. H. Lee, (2008) “Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys”, J. Mat. Res., 23, 3303 (SCI) NSC-96-2628-E-007-018-MY3

22.  C. N. Liao, Y. C. Wang and H. S. Chu, (2008) “Thermal transport properties of nanocrystalline Bi–Sb–Te thin films prepared by sputter deposition”, J. Appl. Phys., 104, 104302 (SCI) NSC-96-2628-E-007-018-MY3

23.  C. N. Liao and L. C. Wu, (2009) “Enhancement of carrier transport properties of BixSb2-xTe3 compounds by electrical sintering process”, Appl. Phys. Lett., 95, 052112. (SCI) NSC-96-2628-E-007-018-MY3

24.  C. N. Liao, L. C. Wu and J. S. Lee, (2010) “Thermoelectric properties of Bi-Sb-Te materials prepared by electric current stressing”, J. Alloys Compd., 490, 468. (SCI) NSC-96-2628-E-007-018-MY3

25.  C. N. Liao and Y. C. Huang, (2010) “Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium”, J. Mat. Res., 25, 391 (SCI) NSC-96-2628-E-007-018-MY3

26.  C. N. Liao, C. Y. Chang and H. S. Chu, (2010) “Thermoelectric properties of electrically stressed Sb/Bi–Sb–Te multilayered films”, J. Appl. Phys., 107, 066103 (SCI) NSC-96-2628-E-007-018-MY3

27.  K. M. Liou and C. N. Liao, (2010) “Electric current enhanced defect elimination in thermally annealed Bi-Sb-Te and Bi-Se-Te thermoelectric thin films”, J. Appl. Phys., 108, 053711 (SCI) NSC-96-2628-E-007-018-MY3

28.  K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu, (2010) “Stability of nanoscale twins in copper under electric current stressing”, J. Appl. Phys. 108, 066103 (SCI).

29.  C. N. Liao, H. D. Shih and P. W. Su, (2010) “Electrocrystallization of Mutually Crossed Bismuth Telluride Nanoplatelets”, Journal of The Electrochemical Society 157, D605 (SCI) NSC 98-3114-E-007-008.

30.  C. N. Liao, W. T. Chen and C. H. Lee, (2010) “Polarity effect on interfacial reactions at soldered junctions of electrically stressed thermoelectric modules”, Appl. Phys. Lett. 97, 241906. (SCI) NSC 98-3114-E-007-008.

31.  C. H. Lee, W. T. Chen and C. N. Liao, (2011) “Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples”, J. Alloys Compd., 509, 5142 (SCI) NSC 98- 3114-E-007-008.

32.  C. N. Liao, X. W. Su, K. M. Liou and H. S. Chu, (2011) “Electrical and thermal transport properties of electrically stressed Bi-Sb-Te nanocrystalline thin films”, Thin Solid Films, 519, 4394. (SCI) NSC 98- 3114-E-007-008.

33.  T. C. Chan, K. C. Chen and C. N. Liao, (2011) “Surface roughness reduction of nanocrystalline Cu thin films by electrical stressing treatment”, Appl. Phys. Lett. (SCI) NSC 99-2221-E-007-023-MY3 .

34. T. C. Chan, Y. L. Chuen and C. N. Liao, (2011) "Manipulating the Crystallographic Texture of Nanotwinned Cu Films by Electrodeposition", Crystal Growth & Design (SCI) NSC 99-2221-E-007-023-MY3

35. S. S. Lin, C. N. Liao, (2011) "Effect of ball milling and post treatment on crystal defects and transport properties of Bi-2(Se,Te)(3) compounds", J. Appl. Phys. (SCI) NSC 98-3114-E-007-008

(B)  研討會論文

1.      C. N. Liao, G. J. Chen and K. N. Tu, “Determination of metal/Si contact temperature during electrical current stressing”, Proceedings of 21st International conference on thermoelectrics, page 345, Long Beach, CA, USA (2002).

2.      C. N. Liao and C. T. Wei, “Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment”, TMS 133rd Annual Meeting & Exhibition, Charlotte, North Caroline, USA (2004).

3.      C. N. Liao and W. T. Chen, ”A Study of Eutectic Sn-Pb Solder Wetting Behavior on Cu Strips Under Thermal Stressing”, TMS 133rd Annual Meeting & Exhibition, Charlotte, North Caroline, USA (2004).

4.      C. N. Liao, S. W. Kuo and C. C. Chang, “Effect of interfacial reaction on thermoelectric properties of Bi/Te bilayer thin film”, 23st International Conference on Thermoelectrics, Adelaide, Australia (2004).

5.      C. N. Liao and K. C. Chen, “Thermoelectric properties of annealed ion-implanted silicon thin films”, 15th International Conference on Ion Implantation Technology, Taipei, Taiwan, ROC (2004)

6.      C. N. Liao, C. M. Tai and W. F. Wu. “Fabrication of CMOS-Compatible High-Quality Inductors” , The 12th Symposium on Nano Device Technology (2005)

7.      C. N. Liao, and J. W. Shih, “Effect of group IV element addition on thermoelectric properties of MNiSn-based (M=Ti, Zr) half-Heusler alloys”, 24th International Conference on Thermoelectrics, Clemson, South Caroline, USA (2005).

8.      C. N. Liao and C. M. Tai, “Fabrication and characterization of high-quality thin film inductors in multi-gigahertz frequency”, 2005 奈米國家型科技計畫成果發表會, 台北國際會議中心.

9.      K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen, “In-situ Microscopic Study of Cu Intragranular Electromigration”, 2005 MRS Fall Meeting, Boston, MA, USA (2005).

10.  C. N. Liao, D. H. She, B. J. Liao and S. W. Kuo, “Preparation of Bismuth Telluride Compound Semiconductors through Thin Film Reactions”, 209th Meeting of The Electrochemical Society, Denver, Colorado, USA, May 7-12, 2006. (Invited)

11.  C. M. Tai and C. N. Liao, “High-quality solenoid inductors on silicon wafers”, International Conference on Communications, Circuits and Systems, Guilin, China, Jun 25-28, 2006.

12.  C. N. Liao, W. J. Chen and J. H. Li, ”Effect of soldering reaction on he electrical properties of bismuth telluride/Cu junctions”, TMS 136th Annual Meeting & Exhibition, Orlando, FL, USA (2007).

13.  C. N. Liao, T. H. She and H. S. Chu, “Preparation of bismuth telluride thin films from thermally annealed Bi/Te multilayer structure”, 26th International Conference on Thermoelectrics, Jeju, Korea (2007).

14.  C. N. Liao, C. H. Lee and W. J. Chen, “Effect of soldering reaction on microstructure and electrical properties of bismuth telluride/Cu junctions”, 26th International Conference on Thermoelectrics, Jeju, Korea (2007).

15.  C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen, “Enhancement of electromigration resistance in twin-structured copper investigated by in situ transmission electron microscopy”, 2008 MRS Spring Meeting, San Francisco, CA, USA (2008).

16.  K. M. Liou and C. N. Liao, “Effect of electric current assisted thermal treatment on thermoelectric properties of Bi-Sb-Te based thin films prepared by sputtering”, 2008 MRS Spring Meeting, San Francisco, CA, USA (2008).

17.  C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu, “A study of atomic-scale copper electromigration by in-situ transmission electron microscopy”, 2008 International Symposium on Materials for Enabling Nanodevices, Tainan, Taiwan, Sep. 3-5 (2008). (Invited)

18.  C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu, “In-situ TEM study of Electromigration in Cu lines”, 10th International Workshop on Stress-Induced Phenomenon in Metallization, Austin, TX, USA (2008). (Invited)

19.  K. M. Liou and C. N. Liao, ”Effect of electric current assisted thermal treatment on thermoelectric properties of Bi-Sb-Te and Bi-Se-Te based thin films prepared by sputtering”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

20.  G. H. Lee and C. N. Liao, ”Effect of Cu addition in Sn solder on the interfacial reaction with element Te substrate”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

21.  Y. C. Huang and C. N. Liao,”A study of interfacial reaction between molten Sn-Ag solder and Te substrate”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

22.  C. N. Liao, K. M. Liou and H. S. Chu, “Effect of electric current stressing on thermoelectric properties of Bi-Sb-Te and Bi-Se-Te thin films prepared by sputtering”, 28th International Conference on Thermoelectrics, Freiburg, Germany (2009).

23.  C. N. Liao, L. C. Wu, “Enhancement of thermoelectric properties of functionally graded Bi-Sb-Te based compounds by electrical sintering”, 28th International Conference on Thermoelectrics, Freiburg, Germany (2009).

24.  C. N. Liao, “In-situ TEM observation of electromigration in nanotwinned copper”, 2nd Tsukuba-Hsinchu Bilateral Symposium on Advanced Materials Science and Technology, Tsukuba, Japan (2009) (Invited)

25.  C. N. Liao, “Investigation of nanotwinned copper under electromigration by in-situ transmission electron microscopy”, Japan-Taiwan Joint Symposium on New Functional Materials and Their Nano-Scale Analysis, Kyoto, Japan (2009) (Invited)

26.  C. Y. Chang and C. N. Liao, “Thermoelectric properties of sputtered Bi-Sb-Te / Sb multilayer films with electric current assisted annealing”, 2009 MRS Fall Meeting, Boston, MA, USA (2009).

27.  C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu “In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under Electromigration”, IEEE International NanoElectronics Conference, Hong Kong, China (2010).

28.   K. C. Chen, W. W. Wu, H. P. Chen, C. N. Liao, L. J. Chen and K. N. Tu, “Electromigration studies at surfaces and grain boundaries using in-situ TEM”, 11th International Workshop on Stress-Induced Phenomenon in Metallization, Dresden, Germany (2010). (Invited)

29.  C. N. Liao “Thermoelectric transport properties of nanocrystalline bismuth telluride based compounds”, 3rd Tsukuba-Hsinchu Bilateral Symposium on Advanced Materials Science and Technology, Hsinchu, Taiwan, Apr. 2-3, 2010 (Invited)

30.  S. S. Lin and C. N. Liao, “Effect of electric current stressing on thermoelectric properties of hot-pressed Bi-Se-Te nanostructured compounds”, 2010 MRS Spring Meeting, San Francisco, CA, USA (2010).

31.  X. W. Su and C. N. Liao, “Effect of electric current stressing on thermal/electrical transport properties of sputtered Bi-Sb-Te thin films”, 2010 MRS Spring Meeting, San Francisco, CA, USA (2010).

32.  C. N. Liao, K. C. Chen, W. W. Wu, H. P. Chen, L. J. Chen and K. N. Tu, “Stability of nanotwinned Cu under electric current stressing”, International Symposium on Materials for Enabling Nanodevices, UCLA, USA, Sep. 8-10, 2010. (Invited)

33.  C. N. Liao, “In-situ TEM study of twin boundary stability in Cu under electric current stressing” MRS-T 2010 Annual Conference, I-Shou University, Nov. 19-20, 2010. (Invited).”

(C) 其它

1.        J. H. Jou and C. N. Liao, “Bending beam technique for the measurement of solvent diffusions in polymer containing layered structures”, Handbook of advanced materials testing, edited by N. P. Cheremisinoff and P. N. Cheremisinoff, Marcel Dekker Inc., New York, pp. 707-713 (1995)

2.        廖建能, ”熱電效應之原理與應用介紹”,電子月刊,第93期160-167頁(2003年4月號)

3.        廖建能, ”熱電材料之應用與未來展望”, 產業奈米技術應用資訊園地－奈米粉體與應用專刊, 113-123頁 (2004年8月號)

4.        C. N. Liao and C. T. Wei, “A Kinetic study of Sn/Cu bimetallic thin film reaction”, J. Mat. Sci. Eng., vol. 37, 82-86, (2005).

5.        廖建能, 劉昆明 ” 電流輔助熱處理對Bi-Sb-Te奈米晶薄膜微結構與熱電特性之影響”,電子月刊,第180期134-141頁(2010年7月號).


　

更新日期： 2012-08-07