| Study of Cu Migration Kinetics under Electric and Thermal Driving Forces |
K. C. Chen |
| Current crowding effect on thermal characteristics of Ni/doped-Si contacts |
K. C. Chen |
| Effect of soldering reaction on microstructure and electrical properties of bismuth telluride/Cu junctions |
C. H. Lee |
| A study of Cu oxidation kinetics at low temperatures |
Y. T. Chen |
| The effect of current assisted thermal treatment on the thermoelectric properties of sputtered Bi-Te based thin films |
K. M. Liou |
| The effect of electric current stressing on thermoelectric properties of sputtered Bi-Te based thin films |
K. M. Liou |
| 電鍍碲化鉍之片狀結構成長機制研究 |
施孝東
蘇柏文 |
| Hydrothermal Route to the Preparation of Diffusion Barriers on Te-based Thermoelements |
H.D. Fang |
| Thermoelectric properties of sputtered Bi-Sb-Te/Sb multilayer films with electric current assisted annealing |
C.Y. Chang |
| Formation of nanoscale twins in Cu films with controllable orientations by electrodeposition |
T. C Chan |
| Characterization of nanotwinned Cu films prepared by pulsed electrodeposition at low temperature |
C. Y. Lin |
