Posters

Study of Cu Migration Kinetics under Electric and Thermal Driving Forces	K. C. Chen
Current crowding effect on thermal characteristics of Ni/doped-Si contacts	K. C. Chen
Effect of soldering reaction on microstructure and electrical properties of bismuth telluride/Cu junctions	C. H. Lee
A study of Cu oxidation kinetics at low temperatures	Y. T. Chen
The effect of current assisted thermal treatment on the thermoelectric properties of sputtered Bi-Te based thin films	K. M. Liou
The effect of electric current stressing on thermoelectric properties of sputtered Bi-Te based thin films	K. M. Liou
電鍍碲化鉍之片狀結構成長機制研究	施孝東蘇柏文
Hydrothermal Route to the Preparation of Diffusion Barriers on Te-based Thermoelements	H.D. Fang
Thermoelectric properties of sputtered Bi-Sb-Te/Sb multilayer films with electric current assisted annealing	C.Y. Chang
Formation of nanoscale twins in Cu films with controllable orientations by electrodeposition	T. C Chan
Characterization of nanotwinned Cu films prepared by pulsed electrodeposition at low temperature	C. Y. Lin

更新日期： 2012-08-07