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Accepted |
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P.-C. Wei, C. N. Liao, H.-J. Wu, D. Yang, J. He, G. V. Biesold-McGee, S. Liang, W.-T. Yen, X. Tang, J.-W. Yeh, Z. Lin, and J. H. He |
“Thermodynamic routes to ultra-low thermal conductivity and high thermoelectric performance”, Adv. Mater. |
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2020 |
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C.-Y. Lan, C.-Y. Hsu, Y.-C. Lee, C. N. Liao* |
“Grain growth behavior and enhanced thermoelectric properties ofPbTe consolidated by high-density pulse current”, J. Alloys Comp., 815, 1526582. |
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2019 |
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H.-H. Fan, W.-L. Weng, C.-Y. Lee, C. N. Liao* |
“Electrochemical Cycling-Induced Spiky CuxO/Cu Nanowire Array for Glucose Sensing”, ACS Omega, 4, 12222 – 12229. |
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2019 |
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C.-L. Huang, W.-L. Weng, Y.-S. Huang C. N. Liao* |
”Enhanced photolysis stability of Cu2O grown on Cu nanowires with nanoscale twin boundaries”, Nanoscale, 11, 13709 - 13713. DOI: 10.1039/c9nr01406c. (Outside Back Cover). |
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2018 |
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Chun-Lung Huang, Wei-Lun Weng, Chien-Neng Liao*, K. N. Tu |
Nature Communications:Suppression of interdiffusion-induced voiding in oxidation of copper nanowires with twin-modified surface |
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2018 |
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W.-L. Weng, C.-Y. Hsu, J.-S. Lee, H.-H. Fan, C. N. Liao* |
“Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core–shell nanowires”, Nanoscale, 10, 9862-9866. |
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2018 |
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J.-C. Hsiao, Y.-H. Chen, C. N. Liao* |
“Anisotropic thermal conductivity of sputtered Bi0.5Sb1.5Te3 films after current-assisted thermal treatment”, Thin Solid Films, 645, 93-96. |
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2018 |
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C.-T. Li, Y.-H. Chen, C. N. Liao* |
“Electrically motivated atomic migration and defect formation in Bi0.5Sb1.5Te3 compounds”, Mater. Chem. Phys., 204, 373-377. (SCI) |
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2018 |
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C.-L. Huang, W.-L. Weng, C. N. Liao*, K. N. Tu |
“Suppression of interdiffusion- induced voiding in oxidation of copper nanowires with twin-modified surface”, Nat. Commun. 9, 340. |
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2017 |
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Y.-H. Chen and C. N. Liao* |
“Transport properties of electrically sintered bismuth antimony telluride with antimony nanoprecipitation”, Appl. Phys. Lett., 111, 143901. |
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2017 |
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Y.-H. Chen and C. N. Liao* |
“Scattering characteristics of grain boundaries in electrically sintered Bi0.4Sb1.6Te3 compounds”, Mater. Lett., 197, 21-23. |
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2017 |
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J.-S. Lee, W.-L. Weng, C. N. Liao* |
“Characterization and modeling of twinning superlattice structure in copper nanowires”, Mater. Lett., 194, 23-25. |
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2017 |
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T. T. Shen, C. N. Liao* |
“Enhancement of fatigue resistance of Bi-Sb-Te films on flexible substrates by current-assisted thermal annealing”, Mater. Lett., 186, 314-317. |
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2016 |
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H.-H. Huang, M.-P. Lu and C. N. Liao* |
“Transverse thermoelectric effect of asymmetrically doped Bi-Sb-Te compounds”, J. Appl. Phys., 119, 205101. |
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2016 |
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Y.-T. Huang, C.-W. Huang, J.-Y. Chen, Y.-H. Ting, S.-L. Cheng, C.-N. Liao and W.-W. Wu |
“Mass transport phenomena in copper nanowires at high current density”, Nano Research, 9, 1071. |
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2016 |
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H.-P. Chen, C.-W. Huang, C.-W. Wang, W.-W. Wu, C.-N. Liao, L.-J. Chen and K.-N. Tu, |
“Optimization of the nanotwin-induced zigzag surface of copper by electromigration”, Nanoscale, 8, 2584. |
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2015 |
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M.-P. Lu, C. N. Liao*, J.-Y. Huang, H.-C. Hsu |
“Thermoelectric Properties of Ag-Doped Bi2(Se,Te)3 Compounds: Dual Electronic Nature of Ag-Related Lattice Defects”, Inorg. Chem., 54, 7438. |
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2015 |
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C.-L. Huang and C. N. Liao* |
“Chemical reactivity of twin-modified copper nanowire surfaces”, Appl. Phys. Lett., 107, 021601. |
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2015 |
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C.-J. Yang, C.-L. Huang and C. N. Liao* |
“Enhancing chemical stability of electroplated Cu films by engineering electrolyte chemistry and twinning structure”, J. Electron. Mat. 44, 2529. |
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2014 |
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T. C. Chan*, Y. M. Lin*, H. W. Tsai*, C. C. Lin*, Z. M. Wang, C. N. Liao!, Y. L. Chueh! |
Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: Controllable nanotwin density and growth orientation with enhanced electrical endurance performance, Nanoscale, 6, 7332, |
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2014 |
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H. W. Tsai*, T. H. Wang*, T. C. Chan*, P. J. Chen*, C. C. Chung*, A. Yaghoubi*, C. N. Liao, E. W.-G. Diau, Y. L. Chueh! |
Fabrication of Large Scale Single Crystal Bismuth Telluride (Bi2Te3) Nanosheet Arrays by Single Step Electrolysis Process, Nanoscale, 6, 7780, |
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2014 |
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Y. L. Liu* and C. N. Liao! |
Experimental and theoretical assessments of thermal boundary resistance between Bi0.4Sb1.6Te3 thin films and metals, Appl. Phys. Lett., 105, 013903, |
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2014 |
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P. H. Le*, C. N. Liao, C. W. Luo, J. Leu! |
Thermoelectric properties of nanostructured bismuth-telluride thin films grown using pulsed laser deposition, J. Alloys Comp. 615, 546–552, |
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2014 |
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P.-J. Chen and C. N. Liao |
“Thermoelectric transport properties of BiTe based thin films on strained polyimide substrates”, Appl. Phys. Lett., 105, 133903. |
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2014 |
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P.-J. Chen* and C. N. Liao! |
Thermoelectric transport properties of Bi-Te based thin films on strained polyimide substrates, Appl. Phys. Lett., 105, 133903, |
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2014 |
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T.-C. Chan*, Y.-Z. Chen*, Y.-L. Chueh!, C. N. Liao! |
Large-scale nanotwins in copper films/Cu nanowires via stress engineering by high energy ion beam bombardment process: growth and characterization, J. Mater. Chem. C, 2, 9777-10038, |
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2013 |
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C. N. Liao!, Y. C. Lu* and D. Xu |
Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition, J. Electrochem. Soc., |
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2013 |
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C. N. Liao!, C.-Y. Lin*, C.-L. Huang* and Y.-S. Lu* |
Morphology, Texture and Twinning Structure of Cu Films Prepared by Low-temperature Electroplating, J. Electrochem. Soc., |
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2013 |
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M.-P. Lu* and C. N. Liao! |
Mechanical and thermal processing effects on crystal defects and thermoelectric transport properties of Bi2(Se,Te)3 compounds, J. Alloys Compd., |
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2013 |
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H.-H. Huang*, M.-P. Lu*, C.-H. Chiu*, L.-C. Su*, C. N. Liao!, J.-Y. Huang, H.-L. Hsieh |
Enhanced Seebeck coefficient of bismuth telluride compounds with graded doping profiles, Appl. Phys. Lett., |
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2013 |
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P. H. Le*, C. N. Liao, C. W. Luo, J.-Y. Lin, J. Leu! |
Thermoelectric properties of bismuth-selenide films with controlled morphology and texture grown using pulsed laser deposition, Appl. Surf. Sci, |
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2012 |
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T. Y. Lin, C. N. Liao, A. T. Wu |
“Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials”, J. Electron. Mat. 41, 153. |
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2011 |
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S. S. Lin and C. N. Liao |
“Effect of ball milling and post treatment on crystal defects and transport properties of Bi2(Se,Te)3 compounds”, J. Appl. Phys., 110, 093707. |
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2011 |
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T. C. Chan, Y. L. Chueh and C. N. Liao |
“Manipulating the crystallographic texture of nanotwinned Cu films by electrodeposition”, Cryst. Growth Des., 11, 4970. |
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2011 |
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T. C. Chan, K. C. Chen and C. N. Liao |
“Surface roughness reduction of nanocrystalline Cu thin films by electrical stressing treatment”, Appl. Phys. Lett., 98, 181902. |
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2011 |
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C. N. Liao, X. W. Su, K. M. Liou and H. S. Chu |
“Electrical and thermal transport properties of electrically stressed Bi-Sb-Te nanocrystalline thin films”, Thin Solid Films, 519, 4394. |
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2011 |
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C. H. Lee, W. T. Chen and C. N. Liao |
“Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples”, J. Alloys Compd., 509, 5142. |
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2010 |
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C. N. Liao, W. T. Chen and C. H. Lee |
“Polarity effect on interfacial reactions at soldered junctions of electrically stressed thermoelectric modules”, Appl. Phys. Lett. 97, 241906. |
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2010 |
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C. N. Liao, H. D. Shih and P. W. Su |
“Electrocrystallization of Mutually Crossed Bismuth Telluride Nanoplatelets”, J. Electrochem. Soc. 157, D605. |
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2010 |
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K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu |
“Stability of nanoscale twins in copper under electric current stressing”, J. Appl. Phys. 108, 066103. |
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2010 |
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K. M. Liou and C. N. Liao |
“Electric current enhanced defect elimination in thermally annealed BiSbTe and BiSeTe thermoelectric thin films”, J. Appl. Phys., 108, 053711. |
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2010 |
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C. N. Liao, C. Y. Chang and H. S. Chu |
“Thermoelectric properties of electrically stressed Sb/Bi–Sb–Te multilayered films”, J. Appl. Phys., 107, 066103. |
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2010 |
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C. N. Liao and Y. C. Huang |
“Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium”, J. Mat. Res., 25, 391. |
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2010 |
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C. N. Liao, L. C. Wu and J. S. Lee |
“Thermoelectric properties of Bi-Sb-Te materials prepared by electric current stressing”, J. Alloys Compd., 490, 468. |
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2009 |
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C. N. Liao and L. C. Wu |
“Enhancement of carrier transport properties of BixSb2-xTe3 compounds by electrical sintering process”, Appl. Phys. Lett., 95, 052112. |
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2008 |
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C. N. Liao, Y. C. Wang and H. S. Chu |
“Thermal transport properties of nanocrystalline Bi–Sb–Te thin films prepared by sputter deposition”, J. Appl. Phys., 104, 104302. |
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2008 |
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C. N. Liao and C. H. Lee |
“Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys”, J. Mat. Res., 23, 3303. |
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2008 |
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S. D. Li, J. G. Duh and C. N. Liao |
“High-frequency ferromagnetic inductors covered by as-deposited FeCoAlO films with stress-induced uniaxial anisotropy”, Thin Solid Films, 516, 7748. |
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2008 |
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K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu |
“Observation of Atomic Diffusion at Twin-modified Grain Boundaries in Copper”, Science, 321, 1066. |
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2008 |
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C. N. Liao, K. M. Liou and H. S. Chu |
“Enhancement of thermoelectric properties of sputtered Bi-Sb-Te thin films by electric current stressing”, Appl. Phys. Lett., 93, 042103. |
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2007 |
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C. M. Chen, C. C. Huang, C. N. Liao, and K. M. Liou |
“Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, J. Electron. Mat. 36, 760. |
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2007 |
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C. M. Tai and C. N. Liao |
”A Physical Model of Solenoid Inductors on Silicon Substrates”, IEEE Trans. Microwave Theory Tech., 55(12), 2579. |
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2007 |
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K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen |
“Direct observation of electromigration-induced surface atomic steps in Cu lines by in-situ transmission electron microscopy”, Appl. Phys. Lett., 90, 203101. |
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2007 |
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C. N. Liao, C. H. Lee and W. J. Chen |
“Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride based thermoelements and copper”, Electrochem. Solid-State Lett., 10(9), P23. |
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2007 |
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C. N. Liao and T. H. She |
Preparation of bismuth telluride thin films through interfacial reaction, Thin Solid Films, 515, 8059. |
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2007 |
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C. M. Tai and C. N. Liao |
Multi-level suspended thin film inductors on silicon wafers, IEEE Trans. Electron. Dev., 54 (6), 1510. |
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2007 |
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C. N. Liao, T. H. She, P. J. Liao and H. S. Chu |
Oscillatory transport properties of thermally annealed Bi/Te multilayer thin films, J. Electrochem. Soc. 154 (4), H304. |
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2006 |
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C. N. Liao, H. N. Wu, P. C. Chen and J. W. Yeh |
Effect of antimony doping on thermoelectric properties of Zr0.5Ti0.5NiSn multi-element alloys, ANNALES DE CHIMIE - science des matériaux, 31(6), 711. |
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2006 |
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C. N. Liao and C. T. Wei |
An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples, Thin Solid Films, 515, 2781. |
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2005 |
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C. N. Liao, C. P. Chung and W. T. Chen |
Electromigration induced Pb Segregation in Eutectic Sn-Pb Molten Solder, J. Mat. Res., 20, 3425. |
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2005 |
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C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen |
In situ transmission electron microscope observations of electromigration in copper lines at room temperature, Appl. Phys. Lett., 87, 141903. |
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2005 |
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C. N. Liao and K. C. Chen |
Effect of interfacial resistance and contact size on current crowding at Ni/poly-Si junctions, Semi. Sci. Tech., 20, 659. |
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2005 |
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C. N. Liao and S. W. Kuo |
Thermoelectric characterization of sputter-deposited Bi/Te bilayer thin films, J. Vac. Sci. Tech. A, 23, 559 (SCI) |
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2005 |
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C. N. Liao and K. M. Liou |
Electrical properties of Cu/Ta interfaces under electrical current stressing, J. Vac. Sci. Tech. A, 23, 359. |
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2004 |
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C. N. Liao and C. T. Wei |
Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment, J. Electron. Mat., 33, 1137. |
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2003 |
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C. N. Liao and K. C. Chen |
Current crowding effect on thermal characteristics of Ni/doped-Si contacts”, IEEE Electron Device Letters, 24, 637. |
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2002 |
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C. N. Liao and K. N. Tu |
Direct measurement of contact temperature using Seebeck potential, J. Appl. Phys., 92, 635. |
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